NVIDIA
Bengaluru, Karnataka, India Posted 2d ago
NVIDIA is seeking a Senior Package Layout Engineer to collaborate with technical package leads and design teams in the development of sophisticated layout of IC substrates.
Key Responsibilities
Collaborate to implement high-speed and high-density ASIC packages.
Perform substrate breakout patterns for ASIC packages.
Optimize package pinout incorporating system-level trade-offs.
Perform package routing, placement, stack-up, and power distribution using Cadence APD or SiP tool suite.
Conduct design feasibility studies to evaluate package design goals.
Requirements
B.S. in Electrical Engineering or equivalent experience.
5+ years of experience in PCB Layout of graphics cards, motherboards, line cards, or related technology.
Significant background with Cadence APD, SiP, or PCB layout tools including Constraint Manager.
Solid understanding of high-speed design signal integrity practices.
